Affiliation in Hong Kong

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Our affiliation in Hong Kong
Agency for electronic component sales

Agency for electronic component sales

We provide various electronic components from the manufacturers BRIGHT DEVICES represents from Japan and all over the world.

Electronic components (manufacturers BRIGHT DEVICES represents )

JAPAN

NIPPON CHEMI-CON
(日本ケミコン)
[Handling products]Capacitors
DEC(第一電機）
[Handling products]Capacitors
TAIYO YUDEN
[Handling products]Capacitors
MARUWA
[Handling products]Capacitors
SANYO DENKI（山洋電気)
[Handling products]Fan/Mortors
PANASONIC(パナソニック)
[Handling products]
Capacitors/Resistors/Relays
KOA
[Handling products]Resistors
SUSUMU（進工業)
[Handling products]Resistors
OMRON（オムロン)
[Handling products]Relays/Connectors
SHINDENGEN（新電元)
[Handling products]Diodes
J.S.T（日本圧着端子製造)
[Handling products]Connectors
DAISHINKU（大真空)
[Handling products]Crystal units
TOSHIBA（東芝)
[Handling products]IC/Diodes
ROHM（ローム)
[Handling products]IC/Diodess
RENESAS
[Handling products]IC/Diodes
TDK
[Handling products]
Inductors/Power supplies
MURATA（村田製作所)
[Handling products]Capacitors

U.S.A

BROADCOM
[Handling products]IC
ALLEGRO MICRO SYSTEMS
[Handling products]IC
ANALOG DEVICES
[Handling products]IC
ATMEL
[Handling products]IC
MAXIM
[Handling products]IC
MICROCHIP
[Handling products]IC
ON SEMICONDUCTOR
[Handling products]IC
Vishay
[Handling products]IC

TAIWAN

PARALIGHT
[Handling products]LED
KING BRIGHT
[Handling products]LED
EVERLIGHTs
[Handling products]LED
PANJIT
[Handling products]Diodes

Printed circuit board (raw circuit board).

FPC (Flexible Printed Circuits ) fine pitch

We contribute the cost reduction of ultra fine pitch FPC.
Available with a minimum pitch of 20 microns (Line-and-space: 10 micron/10 micron L/S=10/10).
Impedance control is available.
*We have accomplished minimum 16 micron pitch （L/S=8/8) as a test sample.

FPC(Flexible printed circuits) standard pitch

Available with a minimum pitch of 80 micron (line-and-space: 40 micron/40 micton, L/S=40/40).
Multi-layer FPC is also available.
Maximum size is 250x500mm.
Impedance control is available.

FR-4 / CEM-3

Maximum number of layers: 30 layers
Maximum manufacturing size: 720x630mm
Manufacturable board thickness: 0.2 mm-6.0 mm
Maximum thickness of copper foil: 525 u
Build-up boards are manufacturable.
Impedance control is available.

Metal board base (aluminium, copper)

Maximum manufacturing size: 650x1200mm.
Manufacturable board thickness: 0.1 mm～10 mm
Maximum thickness of copper foil: 210 u
Suitable for LED illumination, LED back light, hybrid IC, automotive electrical equipment, power source for heat dissipation.

Rigit FPC board

As this allows the wiring design to be highly flexible, high-density wiring and mounting are possible.
We meet all the needs of impedance control, IVH, resin embedding and build-up boards.